Overview
The Indian electronics manufacturing sector is set for a boost with the approval of the first seven projects under the Electronics Component Manufacturing Scheme (ECMS). These projects, with a total investment of ₹5,532 crore, are expected to generate an output of ₹44,406 crore and create 5,195 jobs. This initiative underscores the government's commitment to strengthening the domestic electronics value chain and positioning India as a key player in the global electronics market.
Key Developments
- ECMS Investment: Investment commitments under the scheme have reached ₹1.15 lakh crore, doubling the original target.
- Export Growth: Electronics has emerged as India’s third-largest export category in FY 2024-25, highlighting the sector's rapid growth.
- Scheme Notification: The ECMS was notified on 8 April 2025, with a total outlay of ₹22,919 crore.
Scheme Overview
The Electronics Component Manufacturing Scheme (ECMS), notified on 8 April 2025, aims to create a robust and self-sustaining ecosystem for electronics component manufacturing in India. With a total outlay of ₹22,919 crore (approximately USD 2.7 billion) and a tenure of six years (plus an optional one-year gestation period), the scheme focuses on attracting domestic and global investments across the electronics value chain. The goal is to promote higher domestic value addition and integrate India’s electronic industry with global value chains by encouraging the production of essential components, sub-assemblies, and raw materials within the country.
As of 30 September 2025, investment commitments under the scheme stand at ₹1,15,351 crore, nearly double the original target of ₹59,350 crore. Production worth ₹10,34,751 crore is expected over the next six years, which is 2.2 times higher than the initial projection. The incentive outgo is projected at ₹41,468 crore, around 1.8 times the original estimate of ₹22,805 crore. The scheme is also expected to create 1,41,801 direct jobs, surpassing the target of 91,600, along with a large number of indirect employment opportunities.
Products Covered under the First Set of ECMS Approvals
The first set of approvals covers a diverse range of high-value electronic components and materials critical to modern technology. These projects will strengthen India’s position in the global value chain by enabling large-scale production of components used across smartphones, automobiles, medical devices, telecommunications, and industrial systems.
Camera Module Sub-Assembly
Used in smartphones, drones, medical devices, and robots, camera module sub-assemblies capture high-quality images and videos. They serve as the imaging component in smartphones, tablets, laptops, security cameras, automotive systems, and IoT devices.
Multi-Layer PCB
Multi-layer Printed Circuit Boards (PCBs) are used in automotive, consumer electronics, ICT, medical devices, telecommunication, aerospace and defence, and industrial manufacturing. They have multiple copper and dielectric layers interconnected with through-hole vias and are widely used in consumer electronics, industrial controls, and automotive systems.
HDI PCB
High-density interconnect PCBs are used in consumer electronics and wearable technology, automotive electronics, medical devices, telecommunication, aerospace and defence. These advanced versions of PCBs with microvias, blind and buried vias, via-in-pad structures, finer tracks, and tighter spacing enable compact, high-performance designs for smartphones, tablets, wearables, aerospace, and medical devices.
Laminate (Copper Clad Laminate)
Copper clad laminates are used in automotive, consumer electronics, medical devices, ICT, telecommunication, aerospace and defence, and industrial manufacturing. They serve as the base component for the manufacture of multi-layer PCBs.
Polypropylene Film
Polypropylene film is used in capacitors for consumer electronics, automotive, ICT, industrial and manufacturing, telecommunications, and computing. It is the key material used in the production of capacitors.
Overview of Approved Applications under ECMS
The initial batch of applications reflects a strong commitment from leading domestic manufacturers to build high-value component capacity within India. Spread across Tamil Nadu, Andhra Pradesh, and Madhya Pradesh, these projects involve an investment of ₹5,532 crore, with expected production of ₹44,406 crore and 5,195 new jobs.
| Kaynes Circuits India Private Limited | Multi-Layer Printed Circuit Board (PCB) | Tamil Nadu | 104 | 4,300 | 220 |
| Kaynes Circuits India Private Limited | Camera Module Sub-Assembly | Tamil Nadu | 325 | 12,630 | 480 |
| Kaynes Circuits India Private Limited | HDI PCB | Tamil Nadu | 1,684 | 4,510 | 1,480 |
| Kaynes Circuits India Private Limited | Laminate | Tamil Nadu | 1,167 | 6,875 | 300 |
| SRF Limited | Polypropylene Film | Madhya Pradesh | 496 | 1,311 | 225 |
| Syrma Strategic Electronics Private Limited | Multi-Layer Printed Circuit Board (PCB) | Andhra Pradesh | 765 | 6,933 | 955 |
| Ascent Circuits Pvt Ltd | Multi-Layer Printed Circuit Board (PCB) | Tamil Nadu | 991 | 7,847 | 1,535 |
| Total | 5,532 | 44,406 | 5,195 |